EBC 358
EBC 358
Intel Atom® x6000 Processor
Main Feature:
- Intel Atom® x6000 processor
- 1 x DDR4 SO-DIMM with non-ECC SO-DIMM 3200 MHz up to 32GB
- Support triple display VGA, HDMI, LVDS
- 2 x Intel® GbE LAN, 2 x USB 3.2 (Gen1), 4 x USB 2.0, 3 x RS232, 1 x RS232/485/422, 1 x SATA 3.0 , 8-bit GPIO, HD audio
- 1 x M.2 Key B
- TPM 2.0
- 12V or 24V
EBC 358 is a 3.5-inch single-board computer designed for next-generation edge applications in the 5G era. It is equipped with Intel Atom® x6000E series with 40% higher performance than the previous generation platform, ECB 358 comes with up to 32GB of DDR4 SO-DIMM, offers greater flexibility and expandability than onboard memory. To further enhance its 5G connectivity, the EBC 358 is designed with M.2 and nano SIM slot compatible with 5G network. For reliable Ethernet connectivity in outdoor edge computing, the EBC 358 is equipped with dual Intel® i210 GbE Ethernet controllers for robust industrial LAN connectivity. Best for telematics applications.
The EBC 358 has an operating temperature range of 0°C to 60°C, making this design ideal for embedded applications operating in outdoor or semioutdoor environments.
Barebone
EBC 358 (P/N: 10E00035800X0)
Intel Atom® x6425E processors, DDR4, VGA, HDMI, LVDS, 2 x USB 3.2 (Gen1), 4 x USB 2.0, 2 x GbE LAN, 1 x SATA 3.0, 3 x RS232, 1 x RS232/422/485, M.2 Key B and mini-PCIe
EBC 358-6211E (P/N: 10E00035801X0)
Intel Atom® x6211E processors, DDR4, VGA, HDMI, LVDS, 2 x USB 3.2 (Gen1), 4 x USB 2.0, 2 x GbE LAN, 1 x SATA 3.0, 3 x RS232, 1 x RS232/422/485, M.2 Key B and mini-PCIe
EBC 358-6413E (P/N: 10E00035802X0)
Intel Atom® x6413E processors, DDR4, VGA, HDMI, LVDS, 2 x USB 3.2 (Gen1), 4 x USB 2.0, 2 x GbE LAN, 1 x SATA 3.0, 3 x RS232, 1 x RS232/422/485, M.2 Key B and mini-PCIe
Optional Accessories
EBC358X cooler kit (P/N: 5050200201X00)
EBC358 heat spreader kit (P/N: 5050301100X00)
* Heat Spreader: Please note that the heat spreader is a thermal coupling device that comes in contact with the CPU through thermal gap fillers. It is designed to transfer the heat away from the CPU and is different to a heatsink in terms of cooling properties. Please do not consider it as a heatsink. Additional thermal gap fillers can be used on other components on the module to allow them to come in contact with the heat spreader for heat dissipation.
